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Texas Instruments has developed the first RFID packaging box integrated signature

Texas Instruments TI (Texas Instruments), the manufacturer of RFID tags, and Smurfit stone container Corp, a manufacturer of cardboard and packaging products with Chicago gb/t 3098.3 (2) 000 fastening screws for mechanical properties, have jointly developed a packaging mode "RFID packaging box integrated signature" that applies RFID tags to packaging boxes. In this mode, an RFID tag inlay is directly integrated into the corrugated cardboard box. The tag antenna is directly printed on the box with conductive ink, and the antenna is sealed with RFID strap through conductive adhesive. The cardboard of corrugated cardboard box is divided into three layers: an inner wall layer (vermicelli), a middle corrugated layer and an outer wall layer (vermicelli). The label inlay embedded between the inner wall layer and the waveform layer is well protected

this butterfly shaped RFID tag is composed of an integrated circuit and two conductive gaskets. The company predicts that in the future, this mode of integrating RFID tag inlays into packaging materials will save labor costs for consumer goods packaging companies and become an important pillar industry and a new economic growth point in our province, because this mode does not need to buy independent packaging labels

"this packing box is a future product, a bit like a concept car." Joseph LeBlanc, vice president of research and development of Smurfit stone, said, "the mass production of this product requires a large amount of demand, which is greater than the existing demand for smart tags." However, he believes that the confirmation of this concept is an important step forward. Compared with the manufacturing of finished RFID tags, this kind of RFID tag has fewer materials and production steps, making it possible to produce a large number of low-cost tags

"we have improved the performance of these equipment with this r-developed electronics. The sample of FID integrated tag has been developed for 18 months," said Tony sabetti, head of ti-rfid UHF/retail supply chain. "This is the first RFID tag sample with antenna directly printed on packaging materials."

Sabetti talked about the latest development in the quality and concentration of conductive ink, which has greatly improved the readability of naked labels in packaging boxes. He added that this kind of tag can be produced by Ti RFID/Smurfit ston RFID packaging box or tag process. The antenna will be printed on the tag insert and then sealed with the tag. The process of placing an antenna on an IC chip now does not need to be carried out in a dust-free space, which is why some label packers are interested in Ti label tapes

leblanc said that although there are generally strict regulations on sample preparation and experimental methods in these RFI standards, the requirements for D integrated packaging are not high. Smurfit stone has done a good job in the early model development, because they believe that with the labeling requirements for more items, consumer goods packaging companies will eventually adopt this integrated signature mode

source: RFID world

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